The CondAlign Technology

We develop materials and process technologies based on our patented alignment technology.

Versatile Technology

The technology is flexible and material independent. The application area will determine the need for material properties of the film such as elasticity, light weight, softness, transparency, stickiness, resilience to harsher environments or biocompatibility. This same technology can also be used to produce porous membranes.

How it’s Made

The films are made up of fillers surrounded by a matrix, usually conductive particles and a polymer. The mechanical properties of the films are mainly given by the matrix, while the conductive properties are defined by the particles.

An electric field is used to structure and align the filler particles in a liquid matrix. When applying the electric field, electric dipoles are induced in the particles causing chain formation. The alignment occurs due to electrophoresis, thus it is also possible to align non-conductive particles. This means the particles do neither need to be electrically conductive nor magnetic.

These particle chains form conductive pathways through the material. Depending on the type of particles used, the film can be either electrically or thermally conductive. After alignment, the particles are locked into their aligned positions by curing the surrounding matrix. The result is an aligned anisotropic conductive film.

Advantages

Traditional conductive composites are typically particle rich systems because they must reach the percolation threshold to achieve conductivity. With our process we can achieve conductivity with particle loadings at 0.1% and below. This means particle alignment of CondAlign’s materials can permit at least a tenfold reduction of particle content compared to traditional materials. Significant reduction of filler particles can both lower costs and improve polymer properties, thereby enhancing functionality of the film.

The CondAlign technology has been demonstrated on roll-to-roll manufacturing equipment and the process is scalable and cost effective.

Traditional composites are particle rich systems. CondAlign's technology enables lower particle loadings by aligning the particles into conductive chains.

Traditional composites are particle rich systems. CondAlign's technology enables lower particle loadings by aligning the particles into conductive chains.

Some Demonstrated Parameters

Film properties: Conductive, hard, soft, transparent, flexible, sticky, stretchable

Film thickness: 3 µm – 3 mm

Matrix materials: Polyurethane, acrylics, silicon, epoxy

Particle size: nanometers – 150 µm

Filler particles: Metals, alloys, nanotubes, carbon, alumina, ceramics

Chain density: < 14.000 chains per mm²

Pitch: > 8 µm

Resistance: 0.01 Ω - MΩ through 1 cm²

Filler fraction: 0.005 % – 70 % per volume