Electrically Conductive Materials

The CondAlign technology makes conductive films with anisotropic properties.

The technology is versatile and material independent. It is the application area and the need for material properties such as flexibility, light weight, transparency, stickiness, resilience to harsher environments or biocompatibility that limits the material choices of the film.

Anisotropic Conductive Films

Anisotropic materials can be described as having directionally different material properties. For instance, the material can be insulating in one direction and electrically conductive in another.

Conventional anisotropic conductive films (ACFs) are typically based on epoxy or acryl filled with silver or gold coated polymer particles. ACFs are commonly used to bond and connect components in flat panel displays, touch screens and other electronic devices. When applying conventional anisotropic conductive films, heat and pressure is required to achieve bonding.

Benefits of using ACFs over alternative joining technologies such as soldering, include high interconnection densities, flexible bonding, possibility of lower temperature assembly and miniaturization of the final device.


CondAlign’s Conductive Films


CondAlign’s electrically conductive films have anisotropic properties, however they differ significantly from conventional ACFs:

An important property of our film is the density of conductive points. This is referred to as pitch which is the center-to-center distance between two conductive chains. CondAlign has achieved pitch down to 10µm and below. In conventional ACXFs, the film thickness is constraint to approximately one particle thick. By using our technology, the ratio between film thickness and particle size is not fixed and can to a certain degree be tuned to define the pitch and form an optimized conductive film.

With the CondAlign technology it is possible to get good conductive properties even at low loadings because aligning the filler particles allows for a more effective use of them. Size and geometry of the particles influence the alignment and hence the conductivity.

For CondAlign’s films made in the form of pressure sensitive adhesives (PSA), no heat and little pressure is required for bonding, and the bonding process can be compared to sticking of a double-sided tape.

To learn more about the application areas of our electronically conductive films, go to Markets.