E-Align is CondAligns range of electrically conductive ACF materials ideal for flexible, printed, and hybrid electronics.
E-Align
Discover the future of electronics assembly with E-Align.
Designed to simplify the bonding process, our ACF eliminates the need for pressure and temperature, streamlining manufacturing and saving valuable time.
By utilizing advanced alignment technology, our conductive film reduces particle usage resulting in cost savings, optimal conductivity and retention of flexibility and mechanical performance.
It also ensures anisotropic properties, only conducting through the Z-direction.
Read more about our technology
Application of E-Align
E-align is applied with minimal pressure, which is different to conventional ACF. Watch our walkthrough of how to apply E-align.
Industrial Application
E-Align can be applied with industry standard manufacturing techniques and is therefore easily integrated into your assembly line.
We have several equipment manufacturing partners to provide you with the right solution.
Delivered in formats suited for your device.
E-Align is delivered in many different formats, both full rolls or pre-diecut and slitted. Sizes are customizable.
Various pitches are available for different applications. We will help you find the right E-Align for your needs.
-
E-Align100 is our large to medium pitch adhesive film suitable for:
Flex tail bonding | Flexible and soft battery bonding | Medical patches | Smart labels | IoT | Organic Photovoltaics
-
E-Align25 is developed specifically for applications in printed electronics requiring fine pitch Surface Mount Technology .
The fine pitch enables bonding of the smallest SMDs and DFN and QFN surface mount package styles.
RFID | Microcontroller | Printed electronics
The unique material qualities makes it ideal in many applications. With its softness, room temperature adhesive application and high operational temperatur range E-Align25 enables our customers to re-invent their products and manufacturing processes.
Currently under developent, set to launch Q3 2024. Engineering samples are available.
-
E-Align is our finest pitch material for the smallest electrical components on the market:
Micro LED
Currently under development. Engineering samples are available.
