E-Align100
E-Align is CondAlign’s range of adhesive anisotropic conductive films. E-Align products are designed for application at room temperature with very low bonding pressure (<5 bar). E-Align does not require high temperature during bonding or any post processing in the form of heat curing or high pressure.
E-Align is well suited for bonding in the flexible, printed and hybrid electronics, where the components or substrates may be sensitive to high temperature or pressure.
E-Align is a high performance, robust and cost-efficient bonding film, simple to apply and with a reduced carbon footprint. It is ideal for IoT, organic, printed, flexible and hybrid electronics applications, as well as for EMI shielding/grounding.
E-Align is an enabler for new material– and component combinations that are challenging to bond with existing techniques.
CondAlign’s E-Align100 is suited for bonding and connecting Flex on Flex (FOF), Flex on Board (FOB), Chip on Flex (COF), as well as thin, flexible batteries in IoT products.


- Specific surface resistance measured with ring electrode with 5 mm distance between electrodes.
- Measured using 5 mm2 copper probe head. Resistance value includes copper to ACF contact resistance and ACF resistance. Performance must be tested on end user assembly substrate and in the assembly environ[1]mental conditions (temperature, humidity, application technique, etc.), in order to confirm the value indicated in the table.
- Minimum distance between two neighboring conductor pads, to ensure electrical isolation between those elements. CondAlign test method, microscopy-based and custom PCB.
- Minimum contact area between the pads and film, to ensure conductivity. CondAlign test method and custom PCB.
- ASTM D3330 standard, method F. Peeling of 25 mm wide sample performed at speed of 5 mm/s in “standard environment conditions’’ (23°C), sample dwell time 1 hour.

- E-Align can be slit, die cut and supplied in a range of sizes and form factors, on request from customers.
- End user application temperature range: -40 to +85°C.
- Shelf life: 18 months from date of manufacturing, in original packaging and in a controlled environment (21°C, 50% RH).
- Stated values are for guidance only. End user is advised to verify the performance for specific application.