CondAlign at TechBlick virtual event

“Printed, Hybrid, Structural & 3D Electronics. Quantum Dots: Material Innovations & Commercial Applications

We're happy to announce that CondAlign will be having a presentation during the TechBlick's virtual event.


The title of our talk is "Advantages With Anisotropic Conductive Adhesive Films Comprising Aligned Particles”. It will be presented by our VP Business Development Morten Lindberget at 18:10 on Tuesday 11th May.


For more info about the Printed, Hybrid, Structural & 3D Electronics. Quantum Dots: Material Innovations & Commercial Applications Virtual event: click here