Innovation award to CondAlign!

CondAlign received the “TechConnect Innovation award” during the TechConnect World Innovation Conference and Expo event in Washington, D.C. 22nd to 25th of May. The CondAlign technology received this Award because it placed in the top 15% of all submitted technologies as ranked by the TechConnect Corporate & Investment Partner Committee. 

CEO Guttorm Osborg comments: “Receiving recognition in the form of this award confirms what we have already seen during other conferences and presentations: our technology now catches attention from a larger audience who starts to acknowledge the wide potential of our unique technology. In addition, it is a great motivation factor for all of us working hard to develop this technology and bring it to the market.”

The 2016 TechConnect conference and expo was uniquely designed to accelerate the commercialization of innovations out of the lab and into industry. Read more about this Conference in the separate article on our home page.

A full list of all the TechConnect 2016 National & Global Innovation Awardees can be found here: