CondAlign at 2016 TechConnect
CondAlign attended the 2016 TechConnect World Innovation Conference and Expo event in Washington, D.C. 22nd to 25th of May with a presentation as well as a showcase. This is an annual event uniquely designed to accelerate the commercialization of innovations out of the lab and into industry. The Technical Program spotlights applications focused innovations, materials and devices emerging from industrial, government and academic laboratories worldwide.
Selected and awarded
The conference included a “TechConnect Innovation Challenge”, where companies were given the opportunity to Submit their innovation description, and some of these were selected to pitch their technologies in the conference and showcase them in the expo.
We’re proud to announce that CondAlign were selected in this process, and given the opportunity to pitch and showcase CondAlign and our technology. It is especially rewarding given the selection criteria: “Breakthrough technologies that are ready for licensing, corporate partnering, or investment opportunities”.
In addition, we were awarded with the “TechConnect Innovation Award”, placed in the top 15% of all submitted technologies, as ranked by the TechConnect Corporate & Investment Partner Committee.
Well attended expo
This event, co-located with the 2016 National Innovation Summit the 2016 National Small Business Innovation Research (SBIR) Conference, delivers the world’s largest showcase and accelerator for industry-vetted emerging-technologies ready for commercialization. The joint events, delivers over 4,000 attendees from over 70 countries supporting the development and commercialization of new innovations. In the expo, there were around 200 booths where companies, agencies and universities could either highlight their technologies or request information from the exhibitors. CondAlign experienced an overwhelming interest for our exhibition booth, which triggered off a large number of good discussions and added many potential collaboration partners to our leads list.
For CondAlign, a very useful part of this event was The Innovation Partnering Program, which gathers market-ready, commercially-viable innovations into the largest global technology accelerator program. Through the partnering program, CondAlign got the opportunity to speed-date (15 mins) with 5 of the largest corporations in the world, based on a mutual selection process. It was definitely a positive experience to present and discuss our technology and potential collaboration with top management of these companies. Participation in this program was again based on the selection from the Innovation Challenge.
CondAlign has attended TechConnect before, but never before submitted our technology for the Innovation Challenge. We returned from the event with a large number of new contacts and potential business leads to follow up, and will certainly consider to come back next year.
CondAlign attended with three participants, CTO Henrik Hemmen, VP for BD & Sales Morten Lindberget and Scientist Marie-Audrey Raux. Dr. Hemmen presented our company and technology in the conference.