CondAlign and Copprint - An Outstanding Combination

CondAlign is pleased to highlight the strong compatibility between CondAlign’s anisotropic conductive film and Copprint copper inks. Together, these technologies offer an advanced solution for the production of printed electronics, enabling greater 𝗲𝗳𝗳𝗶𝗰𝗶𝗲𝗻𝗰𝘆, 𝗰𝗼𝘀𝘁-𝗲𝗳𝗳𝗲𝗰𝘁𝗶𝘃𝗲𝗻𝗲𝘀𝘀, and 𝘀𝘂𝘀𝘁𝗮𝗶𝗻𝗮𝗯𝗶𝗹𝗶𝘁𝘆

Copprint’s advanced copper ink, which is fully compostable, enables 𝗿𝗲𝗰𝘆𝗰𝗹𝗮𝗯𝗹𝗲 and 𝗯𝗶𝗼𝗱𝗲𝗴𝗿𝗮𝗱𝗲𝗮𝗯𝗹𝗲 RFID tags and printed circuits. CondAlign’s anisotropic conductive film enables 𝗿𝗼𝗼𝗺 𝘁𝗲𝗺𝗽𝗲𝗿𝗮𝘁𝘂𝗿𝗲 𝗯𝗼𝗻𝗱𝗶𝗻𝗴 with 𝗻𝗼 𝗻𝗲𝗲𝗱 𝗳𝗼𝗿 𝗽𝗼𝘀𝘁 𝗽𝗿𝗼𝗰𝗲𝘀𝘀𝗶𝗻𝗴. Combining the two technologies simplifies the integration of electronic devices on sensitive substrates for RFID and printed electronics. The result is a very cost-efficient and environmentally friendly solution.

The video shows an RFID chip bonded to a printed antenna using Copprint ink on paper. Electrical bonding was performed at room temperature using CondAlign’s newly released E-Align25. No post curing or high pressure is needed. Endurance and environmental testing has confirmed that the contacts withstand conditions far tougher than the paper and typical laminations are designed for.

By combining these innovative technologies, we provide the industry with simple, sustainable, and cost-effective solutions that unlock new possibilities for printed electronics.

Data Sheet for the E-Align25 material used for bonding in this application