Thermal Interface Materials
Efficient heat removal is a crucial issue for progress in the electronics industry
There is an escalation of power density in electronic devices. The main driver for developing superior thermal interface materials (TIMs) is the need for greater thermal flux from heat sensitive components. This ensures better performance, longer lifetime and better reliability of the device.
Read more about the principles of TIM in our technology section.
CondAlign technology can currently be realized with elastomeric pads and PSA tapes. Together, these TIM types represent more than 50% of the current global TIM market, which is estimated to reach approximately 3 B$ in 2025 (IDTechEx, 2016).
With our technology we can achieve the same thermal conductivity in a given material with significant reduction of filler particles. Alternatively, we can achieve larger thermal conductivity with the same particle loading. Both compared to materials with randomly distributed particles. The advantages of this are:
- Reduced cost through reduced use of heat conductive particles.
- Reduced negative impact of high particle loading on the material performance and mechanical properties, e.g. hard, brittle, stiff, reduced transparency.
- Ensures good wetting capabilities and system performance with respect to heat dissipation and resistance to thermal stress.